Mitsubishi R65B Substrate
$545.60
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The Mitsubishi R65B Substrate, model R65B, offers exceptional thermal conductivity and flatness. Key specs: dimensions of 300mm x 200mm, thickness of 0.635mm, and a thermal conductivity of 170 W/mK. Ideal for high-power applications requiring efficient heat dissipation.
The Mitsubishi R65B Substrate, model R65B, is a high-performance substrate designed for demanding applications requiring superior thermal management and dimensional stability. This substrate excels in efficiently dissipating heat, ensuring optimal performance and reliability of electronic components. The Mitsubishi R65B Substrate boasts exceptional thermal conductivity, a critical feature for managing heat generated by high-power devices. Its flatness ensures consistent contact between the substrate and mounted components, improving thermal transfer and overall system performance. Specifications include dimensions of 300mm x 200mm, providing a substantial surface area for component mounting. The substrate has a carefully controlled thickness of 0.635mm, contributing to its structural integrity and thermal characteristics. A key feature is its high thermal conductivity of 170 W/mK, enabling efficient heat spreading. The Mitsubishi R65B Substrate is suitable for a wide range of applications, including power amplifiers, LED lighting, and high-frequency circuits. It is particularly well-suited for models where thermal performance is a primary concern. Its robust design and high-quality materials ensure long-term reliability and performance in demanding operating environments. The R65B substrate is a cornerstone component for advanced electronic assemblies.
